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Rumah > Produk > ICS Sirkuit Terpadu > XCZU47DR-2FSVE1156I
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Kirimkan surat.
XCZU47DR-2FSVE1156I
XCZU47DR-2FSVE1156I

XCZU47DR-2FSVE1156I

Rincian produk

Syarat Pembayaran & Pengiriman

Stock: In Stock

Shipping Method: LCL, AIR, FCL, Express

Description: IC ZUP RFSOC A53 FPGA 1156BGA

Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram

Dapatkan Harga Terbaik

Rincian produk

Deskripsi Produk
Menyoroti:
Category:
Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status:
Active
Peripherals:
DMA, WDT
Primary Attributes:
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Series:
Zynq® UltraScale+™ RFSoC
Package:
Tray
Mfr:
AMD
Supplier Device Package:
1156-FCBGA (35x35)
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
-40°C ~ 100°C (TJ)
Architecture:
MCU, FPGA
Package / Case:
1156-BBGA, FCBGA
Number of I/O:
366
RAM Size:
256KB
Speed:
533MHz, 1.333GHz
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
Category:
Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status:
Active
Peripherals:
DMA, WDT
Primary Attributes:
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Series:
Zynq® UltraScale+™ RFSoC
Package:
Tray
Mfr:
AMD
Supplier Device Package:
1156-FCBGA (35x35)
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
-40°C ~ 100°C (TJ)
Architecture:
MCU, FPGA
Package / Case:
1156-BBGA, FCBGA
Number of I/O:
366
RAM Size:
256KB
Speed:
533MHz, 1.333GHz
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
XCZU47DR-2FSVE1156I
Quad ARM® Cortex®-A53 MPCoreTM dengan CoreSightTM, Dual ARM®CortexTM-R5 dengan CoreSightTM System On Chip (SOC) IC Zynq® UltraScale+TM RFSoC Zynq®UltraScale+TM FPGA, 930K+ Logic Cells 533MHz, 1.333GHz 1156-FCBGA (35x35)

Tags:

IKW50N60H3,

IKW50N60H3 IC

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