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Kontak: Ms. Yili

Telp: 86--18906811134

Faks: 86--18906811134

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XCZU7EG-3FFVC1156E

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Syarat Pembayaran & Pengiriman

Stock: In Stock

Shipping Method: LCL, AIR, FCL, Express

Description: IC SOC CORTEX-A53 1156FCBGA

Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram

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Deskripsi Produk

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Category:	Integrated Circuits (ICs) Embedded System On Chip (SoC)	Base Product Number:	XCZU7
Product Status:	Active	Peripherals:	DMA, WDT
Primary Attributes:	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Series:	Zynq® UltraScale+™ MPSoC EG
Package:	Tray	Mfr:	AMD
Supplier Device Package:	1156-FCBGA (35x35)	Connectivity:	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:	0°C ~ 100°C (TJ)	Architecture:	MCU, FPGA
Package / Case:	1156-BBGA, FCBGA	Number of I/O:	360
RAM Size:	256KB	Speed:	600MHz, 667MHz, 1.5GHz
Core Processor:	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size:	-

Category:	Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number:	XCZU7
Product Status:	Active
Peripherals:	DMA, WDT
Primary Attributes:	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Series:	Zynq® UltraScale+™ MPSoC EG
Package:	Tray
Mfr:	AMD
Supplier Device Package:	1156-FCBGA (35x35)
Connectivity:	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:	0°C ~ 100°C (TJ)
Architecture:	MCU, FPGA
Package / Case:	1156-BBGA, FCBGA
Number of I/O:	360
RAM Size:	256KB
Speed:	600MHz, 667MHz, 1.5GHz
Core Processor:	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:	-

XCZU7EG-3FFVC1156E

Quad ARM® Cortex®-A53 MPCoreTM dengan CoreSightTM, Dual ARM®CortexTM-R5 dengan CoreSightTM, ARM MaliTM-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+TM MPSoC EG Zynq®UltraScale+TM FPGA,504K+ Logic Cells 600MHz, 667MHz, 1.5GHz 1156-FCBGA (35x35)

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